松下耐高温芯片倒装底填胶CV5300AK01EPS

松下耐高温芯片倒装底填胶cv5300ak01eps
liquid encapsulant materials
cv5300ak
technical information
encapsulation materials department plastic materials business unit electronic materials business division
panasonic industory co., ltd
this is one component epoxy for flip-chip underfilling.
typical properties
properties
unit
data
test method
viscosity(25oc)
pa*s
20
kes-b-0102
gelation time
sec
800
eks-b-1051
recommending preheat condition
temperature of substrate : 80～120oc
temperature of syringe : r.t.～ 60oc
typical cured properties
measurement cure conditions : 100'c2hour + 150`c 2hour
松下耐高温芯片倒装底填胶cv5300ak01eps
・stored compound must be thawed before use. warm at room temperature until no longer cool to touch (about 2hrs).
・please use up the material within 12 hrs.
・compound must be stored in the cool condition with sealing.
・please keep material under -40oc after receiving product.
attention to handling
・please avoid direct contact with this product by wearing gloves, protecting gears,etc.
・prevent frequent skin contact. if contact occurs, wash immediately with soap and water.
松下耐高温芯片倒装底填胶cv5300ak01eps