丰罗E-Solder-3022双组分银胶

typicalapplications of e-solder 3022 are lead terminations, printedcircuits and shielding on bases which will not withstand theelevated temperatures required for fired-on coatings or solders.e-solder 3022 is an epoxy silver paste recommended for applicationsre low electrical resistance and good adhesive properties.e-solder 3022 requires the addition of hardener no. 18 to hardenand cure. e-solder 3022 may be cured at room temperature, howeverthe application of heat will accelerate and shorten the curetime
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e-solder 3022的典型应用是引线端接、印刷电路和底座上的屏蔽，它们不能承受烧制涂层或焊料所需的高温。e-solder3022 是一种环氧银浆，推荐用于需要低电阻和良好粘合性能的应用。e-solder3022 需要添加 18 号硬化剂来硬化和固化。e-solder3022 可在室温下固化，但加热会加速并缩短固化时间.
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